Stencil metal stamping assembly

A stencil stamp assembly having a comparatively tiny size, excellent ink carrying ability, great metal stamping toughness and is capable of metal stamping pictures having a significant print standard. The stencil stamp involves a handgrip along with a stencil stamp assembly.

The stencil stamp assembly involves an ink bearing associate covered with a thermal stencil sheet. The thermal stencil sheet has a plurality of pores on holes organized in a pattern. During a metal stamping action, ink within the ink bearing associate is forced through the pores in the stencil sheet and onto a recording sheet to shape a stamped image found on the recording sheet.

The ink bearing associate has at minimum 2 levels having different densities. The less dense layer is within contact with all the thermal stencil sheet. The minimum thick layer delivers a big ink storage ability. The more dense layer has a high ink carrying capability, which reduces the potential for ink leakage. The more dense layer is additionally more fast, which reduces creasing and distortion of the stencil sheet both during metal stamping and during formation of the pore pattern in the stencil sheet.

Stamps offered with a rubber metal stamping associate have been utilized for metal stamping the surface of the recording sheet with firm names, addresses as well as the like in character strings. Usually, stamps for these uses are prepared individually, to purchase. As a happen, the stamps are comparatively pricey, and it demands a comparatively extended time to procure a stamp after placing an purchase.

A thermal stencil sheet has been practically utilized on these stamps rather of the rubber metal stamping associate. Pores is created in a desired pattern in a thermal stencil sheet with infrared beams or perhaps a thermal head.

Character strings, patterns and/or marks is printed on a recording sheet by pressing ink through the pores of the stencil sheet, onto the recording sheet.

A stencil stamp assembly comprising, as main components, the aforesaid thermal stencil sheet and an ink-bearing associate impregnated with ink is disclosed in Japanese Utility Model Laid-open publication No. Hei 5-74833. This earlier proposed stencil stamp assembly is capable of substituting traditional stamps offered with a rubber metal stamping associate.

This stencil stamp assembly is fabricated by adhesively attaching an ink-bearing associate impregnated with ink to a frame surrounding the ink-bearing associate, and adhesively attaching a thermal stencil sheet to the frame.

When utilizing the stencil stamp assembly on a metal stamping device, the stencil stamp assembly is adhesively connected to a pillow associate on a lower surface of the base of the metal stamping device. The metal stamping device is offered with a handgrip. Character strings or the like are created in a desired pattern in the thermal stencil sheet with infrared beams or perhaps a thermal head. The resulting metal stamping device is capable of printing countless duplicates of the desired pattern or character strings on a recording sheet.

In this metal stamping device, pores is created in the thermal stencil tape in almost any desired pattern because the metal stamping device involves a supply of empty thermal stencil tape, as well as the thermal pore forming device is capable of forming pores in the metal stamping associate in a desired pattern input by the consumer. Additionally, the metal stamping associate need not be inked by an exterior inking device because ink is used automatically to the metal stamping associate by the ink-bearing associate included in the metal stamping device.

After a certain amount of ink has been consumed during metal stamping, the rate of supply of ink to the metal stamping airplane reduces. Even when the ink-bearing associate nevertheless contains a considerable amount of ink, the ink is utilized inefficiently. As a outcome, the stencil metal stamping assembly should be changed before all ink has been utilized, as well as the expense of utilizing a stencil stamp is comparatively excellent.

An object of the present innovation is to give a stencil metal stamping assembly having a miniaturized construction, excellent ink carrying capability, significant metal stamping durability, and that is capable of top-quality metal stamping.

With the foregoing object in view, the present innovation is guided to a stencil metal stamping assembly having a base associate connectable to a handgrip, an ink-bearing associate impregnated with ink and fixed to a lower surface of the base associate, along with a thermal stencil sheet covering a lower surface of the ink-bearing associate and forming a metal stamping element. The ink-bearing associate has a laminated structure comprising at smallest 2 levels, each layer having a different density. The layer having a high density can be nearer to the thermal stencil sheet than the layer having a lower density.

The layer of the ink-bearing associate having a lower density is capable of carrying a fairly big amount of ink to offer excellent metal stamping toughness for the stencil stamp assembly. The layer having a high density has a reasonably excellent ink carrying ability and is capable of preventing leakage of the ink. Also, because ink is moved constantly within the low density layer to the significant density layer by capillary action, the significant density layer won’t run brief of ink. Additionally, because the excellent density layer is comparatively rigid, the excellent density layer withstands metal stamping stress and is capable of preventing creasing as well as the bending of the thermal stencil sheet.

As is obvious within the foregoing description, a stencil stamp assembly embodying the present innovation has a comparatively little size, and is offered with an ink-bearing associate having a excellent ink carrying ability. Additionally, because the lower part of the ink-bearing associate is fairly fast, the stamp assembly enables very exact pore formation. Because pores is created with ideal precision, the stamp is capable of forming metal stamping patterns having significant print standard. The stencil stamp also offers great metal stamping toughness. Because issues attributable to ink, like ink leakage, is solved by differing the characteristics of the ink-bearing associate, the metal stamping device can use an ink having a comparatively low viscosity, and different embodiments of the stencil stamp assembly is built to meet specific consumer demands.

Once pores are created in a desired pattern in the thermal stencil sheet, the metal stamping element is pushed from the surface of the recording sheet. Ink held by the ink-bearing associate is pushed out through the pores and onto the recording sheet to shape the desired pattern found on the recording sheet.

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